• DocumentCode
    2861288
  • Title

    Impact of body resistance on RF linearity of SOI MOSFET circuits

  • Author

    Pourdavoud, Neda ; Daghighi, Arash

  • Author_Institution
    Young Researchers Club, Najafabad Islamic Azad Univ., Najafabad, Iran
  • fYear
    2011
  • fDate
    21-24 June 2011
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    Body resistances (RB) of body-contacted (BC) partially-depleted (PD) SOI MOSFETs are adjusted by a proper layout structure. The transition in the output conductance frequency response due to the finite body resistance was eliminated. Transition-free (TF) curves for 45 nm SOI MOSFET at various biasing points were extracted. The TF concept was used to design a 2.4 GHz cascode low noise amplifier. Mixed-mode transient device and circuit simulation was performed to obtain the output signal spectrum. Simulation results of TF SOI LNA showed 6 dB and 9 dB reduction in HD3 and THD at Vin=0.1 mV, respectively, comparing with the conventional BC SOI circuit. Third order intercept point (IP3) was improved by 3 dB at Vin=0.1 mV in TF SOI LNA. Simulation results confirmed the linearity advantage of RF SOI circuit based on the transition-free operating regime.
  • Keywords
    MOSFET circuits; circuit simulation; low noise amplifiers; radiofrequency integrated circuits; silicon-on-insulator; RF linearity; SOI MOSFET circuits; body-contacted partially-depleted; cascode low noise amplifier; circuit simulation; finite body resistance; frequency 2.4 GHz; mixed-mode transient device; output conductance frequency response; size 45 nm; third order intercept point; transition-free curves; Frequency response; Immune system; Layout; Linearity; MOSFET circuits; Radio frequency; Simulation; Body resistance; MOSFET; Mixed mode device and circuit simulation; Output conductance; SOI;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanoelectronics Conference (INEC), 2011 IEEE 4th International
  • Conference_Location
    Tao-Yuan
  • ISSN
    2159-3523
  • Print_ISBN
    978-1-4577-0379-9
  • Electronic_ISBN
    2159-3523
  • Type

    conf

  • DOI
    10.1109/INEC.2011.5991660
  • Filename
    5991660