DocumentCode
2861747
Title
Metal-semiconductor-metal electron detector with nano-hole array structure to improve the electricity characteristic and enhance the performance
Author
Lee, Ming-Lun ; Ho, Kung-Chu ; Lee, Chieh-Wei ; Kuan, Chieh-Hsiung
Author_Institution
Grad. Inst. of Electron. Eng., Nat. Taiwan Univ., Taipei, Taiwan
fYear
2011
fDate
21-24 June 2011
Firstpage
1
Lastpage
2
Abstract
In this work, we first fabricated the conventional metal-semiconductor-metal (MSM) interdigitated electron detector with aluminum contact as the control group, then used e-beam lithography system and reactive ion etcher (RIE) to fabricate nano-hole array structure on the contact area and used RIE to fabricate the periodic rectangle trench in the active area of the electron detector as another MSM interdigitated electron detector at the same time as the experimental group. According to the experimental data, we found that the electricity characteristic and the performance of the electron detector with nano-hole array structure which were better than those without the nano-hole array structure.
Keywords
electron beam lithography; metal-semiconductor-metal structures; nanofabrication; sensors; sputter etching; aluminum contact; e-beam lithography system; electricity characteristic; interdigitated electron detector; metal-semiconductor-metal electron detector; nano-hole array structure; periodic rectangle trench; reactive ion etcher; Aluminum; Arrays; Dark current; Detectors; Electricity; Nanostructures; Periodic structures; Metal-Semiconductor-Metal; nano-hole array; reactive ion etcher;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanoelectronics Conference (INEC), 2011 IEEE 4th International
Conference_Location
Tao-Yuan
ISSN
2159-3523
Print_ISBN
978-1-4577-0379-9
Electronic_ISBN
2159-3523
Type
conf
DOI
10.1109/INEC.2011.5991690
Filename
5991690
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