DocumentCode :
2863042
Title :
MEMS packaging for reliable resonators and oscillators
Author :
Kim, B. ; Melamud, R. ; Candler, R.A. ; Hopcroft, M.A. ; Kenny, T.W.
Author_Institution :
Departments of Mechanical and Electrical Engineering, Stanford University, CA 94305, USA
fYear :
2012
fDate :
17-22 June 2012
Firstpage :
1
Lastpage :
3
Abstract :
MEMS resonators have been discussed as replacements for quartz crystals in electronics timing applications for more than 40 years. There have been impressive demonstrations of many important characteristics for resonators and oscillators throughout the last 20 years. However, MEMS resonators had always exhibited unacceptable levels of long-term frequency drift. Recent work has shown that placement of MEMS resonators in high-quality packages can eliminate the sources of drift. The emergence of high-quality, low-cost packaging for MEMS resonators has enabled the first demonstrations of long-term stability and opened the door for commercial applications.
Keywords :
Encapsulation; Fabrication; Micromechanical devices; Oscillators; Resonant frequency; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest (MTT), 2012 IEEE MTT-S International
Conference_Location :
Montreal, QC, Canada
ISSN :
0149-645X
Print_ISBN :
978-1-4673-1085-7
Electronic_ISBN :
0149-645X
Type :
conf
DOI :
10.1109/MWSYM.2012.6259391
Filename :
6259391
Link To Document :
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