Title :
MEMS packaging for reliable resonators and oscillators
Author :
Kim, B. ; Melamud, R. ; Candler, R.A. ; Hopcroft, M.A. ; Kenny, T.W.
Author_Institution :
Departments of Mechanical and Electrical Engineering, Stanford University, CA 94305, USA
Abstract :
MEMS resonators have been discussed as replacements for quartz crystals in electronics timing applications for more than 40 years. There have been impressive demonstrations of many important characteristics for resonators and oscillators throughout the last 20 years. However, MEMS resonators had always exhibited unacceptable levels of long-term frequency drift. Recent work has shown that placement of MEMS resonators in high-quality packages can eliminate the sources of drift. The emergence of high-quality, low-cost packaging for MEMS resonators has enabled the first demonstrations of long-term stability and opened the door for commercial applications.
Keywords :
Encapsulation; Fabrication; Micromechanical devices; Oscillators; Resonant frequency; Silicon;
Conference_Titel :
Microwave Symposium Digest (MTT), 2012 IEEE MTT-S International
Conference_Location :
Montreal, QC, Canada
Print_ISBN :
978-1-4673-1085-7
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2012.6259391