Improvement of lumen efficiency in white light-emitting diodes by roughened-dispensing package

Author

Chen, H.C. ; Chen, K.J. ; Hung, C.W. ; Wang, C.H. ; Yeh, C.C. ; Lin, C.C. ; Kuo, H.C.

Author_Institution

Dept. of Photonics, Nat. Chiao Tung Univ., Hsinchu, Taiwan

fYear

2011

fDate

21-24 June 2011

Firstpage

1

Lastpage

2

Abstract

White light-emitting diodes (LEDs) with roughened-dispensing package through a simple imprinting technique are demonstrated and fabricated. The imprinting mold was fabricated by naturally wet-etched (100) Si substrate, which did not require expensive lens mold and pattern definition. The lumen output of roughened-dispensing package was enhanced by 5.4 % and 2.5 %, at driving current of 120 mA, compared to reference flat phosphor-dispensing package without and with lens molding, respectively.

Keywords

electronics packaging; light emitting diodes; LED; Si; current 120 mA; efficiency 2.5 percent; efficiency 5.4 percent; imprinting mold; imprinting technique; lens molding; lumen efficiency; reference flat phosphor-dispensing package; roughened-dispensing package; white light-emitting diodes; Lenses; Light emitting diodes; Phosphors; Rough surfaces; Silicon; Surface roughness; Surface treatment; Light-emitting diodes; imprinting; package; phosphor;

fLanguage

English

Publisher

ieee

Conference_Titel

Nanoelectronics Conference (INEC), 2011 IEEE 4th International

Conference_Location

Tao-Yuan

ISSN

2159-3523

Print_ISBN

978-1-4577-0379-9

Electronic_ISBN

2159-3523

Type

conf

DOI

10.1109/INEC.2011.5991804

Filename

5991804