Title :
IEE Colloquium on `Coupling Electromagnetic to Other Fields´ (Digest No.117)
Abstract :
The following topics were dealt with: electromagnetic, thermal and stress field coupling; magnetic and electric circuit coupling; bending and heating; induction and microwave heating process modelling; semiconductor power device modelling; printed circuit and component coupling; and RF industrial applicator optimisation
Keywords :
bending; coupled circuits; electromagnetic devices; electromagnetic fields; induction heating; industrial plants; magnetic circuits; printed circuits; radiofrequency heating; semiconductor device models; stress analysis; thermal analysis; RF industrial applicator optimisation; bending; electromagnetic field coupling; induction heating; magnetic and electric circuit coupling; microwave heating; printed circuit and component coupling; semiconductor power device modelling; stress field coupling; thermal field coupling;
Conference_Titel :
Coupling Electromagnetic to Other Fields, IEE Colloquium on
Conference_Location :
London
