• DocumentCode
    2863675
  • Title

    Developing the properties of polyvinylidene fluoride/(Ba0.8Sr0.2)(Ti0.9Zr0.1)O3 composite films for embedded capacitors using

  • Author

    Wu, Chia-Ching ; Sun, Tai-Ping ; Hsieh, Yuan-Tai ; Kuo, Chin-Guo ; Yang, Cheng-Fu

  • Author_Institution
    Dept. of Electron. Eng., Kao Yuan Univ., Kaohsiung, Taiwan
  • fYear
    2011
  • fDate
    21-24 June 2011
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    The average particle sizes of nanoscale (Ba0.8Sr0.2)(Ti0.9 Zr0.1)O3 ceramic powder (nano-BSTZ) was approximately 73nm. Polyvinylidene fluoride (PVDF)/nano-BSTZ composite films with various contents of the nano-BSTZ were screen-printed on indium tin oxide glass substrates. From the XRD patterns, PVDF was the semicrystalline type polymer. The content of the nano-BSTZ increased from 10 wt% to 50 wt%, the dielectric constants of the PVDF/nano-BSTZ films slightly decreased with increasing measured frequency. The specific capacitance values of the PVDF/nano-BSTZ composite films mixing with 50 wt% nano-BSTZ was 11.6 nF/cm2 (measured at 1 kHz). Those results suggested that the PVDF/nano-BSTZ composite films were a good candidate to develop thinner embedded capacitor devices with higher capacitance value.
  • Keywords
    X-ray diffraction; barium compounds; capacitors; filled polymers; nanocomposites; permittivity; strontium compounds; (Ba0.8Sr0.2)(Ti0.9Zr0.1)O3; Embedded Capacitors; PVDF; XRD; dielectric constants; indium tin oxide glass substrates; polyvinylidene fluoride composite films; semicrystalline type polymer; specific capacitance; Capacitance; Ceramics; Dielectric constant; Dielectric measurements; Films; Polymers; Powders; (Ba0.8Sr0.2)(Ti0.9Zr0.1)O3; embedded device; nanoscale ceramic powder; polyvinylidene fluoride;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanoelectronics Conference (INEC), 2011 IEEE 4th International
  • Conference_Location
    Tao-Yuan
  • ISSN
    2159-3523
  • Print_ISBN
    978-1-4577-0379-9
  • Electronic_ISBN
    2159-3523
  • Type

    conf

  • DOI
    10.1109/INEC.2011.5991809
  • Filename
    5991809