DocumentCode :
2864605
Title :
High-frequency design considerations of dual active bridge 1200 V SiC MOSFET DC-DC converter
Author :
Kadavelugu, Arun ; Baek, Seunghun ; Dutta, Sumit ; Bhattacharya, Subhashish ; Das, Mrinal ; Agarwal, Anant ; Scofield, James
Author_Institution :
FREEDM Syst. Center, North Carolina State Univ., Raleigh, NC, USA
fYear :
2011
fDate :
6-11 March 2011
Firstpage :
314
Lastpage :
320
Abstract :
Silicon carbide (SiC) is more favorable than Silicon (Si) to build high voltage devices due its wider band-gap and higher critical field strength. Especially, the SiC MOSFETs are finding their niche in 1 kV range, which is currently dominated by Si IGBTs. This paper aims at demonstrating high power and high frequency operation of the SiC MOSFETs, as a means to evaluate the feasibility of using SiC MOSFETs for high power density applications. The sample devices chosen for this study are 1200 V, 20 A, SiC MOSFETs co-packed with 10 A JBS diodes - manufactured by the CREE Inc. A dual active bridge (DAB) converter has been built to validate the suitability of SiC devices for high power density converters. The design details of the DAB hardware, and the high frequency transformer used for interfacing both the bridges are given. Experimental results on the DAB at 100 kHz switching frequency are presented. Finally, the device switching waveforms up to 1 MHz are given.
Keywords :
DC-DC power convertors; bridge circuits; high-frequency transformers; insulated gate bipolar transistors; power MOSFET; silicon compounds; IGBT; SiC; critical field strength; current 20 A; dual active bridge MOSFET DC-DC converter; frequency 100 kHz; high frequency transformer; high power density converters; high-frequency design; voltage 1200 V; Bridge circuits; Converters; Copper; Inductance; Silicon; Silicon carbide; Windings;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Applied Power Electronics Conference and Exposition (APEC), 2011 Twenty-Sixth Annual IEEE
Conference_Location :
Fort Worth, TX
ISSN :
1048-2334
Print_ISBN :
978-1-4244-8084-5
Type :
conf
DOI :
10.1109/APEC.2011.5744614
Filename :
5744614
Link To Document :
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