• DocumentCode
    2866238
  • Title

    Case study for root cause analysis of yield problems

  • Author

    Malinaric, Dan ; Hoffmeister, Richard R. ; Sun, Cindy

  • Author_Institution
    Atmel Corp., Colorado Springs, CO, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    8
  • Lastpage
    13
  • Abstract
    New RAD (rapid application development) tools, software and high performance database technology enable development of analysis software that performs tasks that were either too complex or time-consuming with older technology. The Klarity ACE (Advanced Correlation Engine) software package was specifically developed to meet the analysis needs of practicing semiconductor professionals. It can be applied to the needs of yield, product development, and test engineers and also provides many tools for process engineers to analyze detailed processing equipment data such as chamber etch rates, gas flows, and equipment-related data. Besides supplying tools for routine analysis tasks such as making control and capability charts; advanced features such as commonality analyses and tool variance and sensitivity are included
  • Keywords
    etching; integrated circuit testing; integrated circuit yield; product development; production engineering computing; production testing; Advanced Correlation Engine; Klarity ACE; RAD; capability charts; chamber etch rates; commonality analyses; database technology; equipment-related data; gas flows; processing equipment data; product development; rapid application development; software package; test engineers; tool variance; yield problems; Analysis of variance; Application software; Data engineering; Databases; Engines; Performance analysis; Product development; Software packages; Software performance; Software tools;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference and Workshop, 2000 IEEE/SEMI
  • Conference_Location
    Boston, MA
  • ISSN
    1078-8743
  • Print_ISBN
    0-7803-5921-6
  • Type

    conf

  • DOI
    10.1109/ASMC.2000.902551
  • Filename
    902551