• DocumentCode
    2866352
  • Title

    Measuring efficiency of semiconductor manufacturing operations using data envelopment analysis (DEA)

  • Author

    Carbone, Thomas A.

  • Author_Institution
    Fairchild Semicond., USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    56
  • Lastpage
    62
  • Abstract
    All manufacturing requires metrics of inputs and outputs of a process. Many companies use reports of metrics to quantify and score particular areas of the manufacturing process. The goal of such activity is to define who is efficient, find out why and then apply this across the organization. Organizing the obtained data is always a complicated task A method of metric analysis is needed that deals with multiple inputs and multiple outputs. The only method available to deal with multiple inputs and outputs is Data Envelopment Analysis (DEA). The paper explains how DEA can be used in a semiconductor manufacturing environment to identify areas of best practice within a fabricator
  • Keywords
    data envelopment analysis; integrated circuit manufacture; DEA; data envelopment analysis; manufacturing environment; metric analysis; multiple inputs; multiple outputs; semiconductor manufacturing operations; Best practices; Data envelopment analysis; Integrated circuit technology; Manufacturing industries; Manufacturing processes; Measurement; Organizing; Pulp manufacturing; Semiconductor device manufacture; Semiconductor materials;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference and Workshop, 2000 IEEE/SEMI
  • Conference_Location
    Boston, MA
  • ISSN
    1078-8743
  • Print_ISBN
    0-7803-5921-6
  • Type

    conf

  • DOI
    10.1109/ASMC.2000.902558
  • Filename
    902558