DocumentCode
2866690
Title
Critical factors in successful transfer of semiconductor products across factories
Author
Pullon, Mike ; Kong, George
Author_Institution
Motorola Inc., Austin, TX, USA
fYear
2000
fDate
2000
Firstpage
157
Lastpage
161
Abstract
Semiconductor devices are transferred from one manufacturing factory to another in order to adapt to business changes, to support more advanced technology development, or to take advantage of external foundry business. The challenge is to utilize the optimal amount of engineering resources and to transfer in the shortest time without disruption of product delivery to the end customers. While there is relatively little literature that describes the issues and factors that impact the transfer process, this paper describes and summarizes experience learned through managing over 60 CMOS transfers in parallel, across multiple factories within and outside of the country. Critical factors that impacted the transfer timeline and corresponding recommendations are identified. A project management process is also described to identify potential risks involved and project slippage as early as possible to minimize customer impact
Keywords
CMOS integrated circuits; integrated circuit manufacture; production control; project management; risk management; CMOS; business changes; engineering resources; external foundry business; manufacturing factory; multiple factories; product delivery; project management process; project slippage; semiconductor product transfer; transfer timeline; Business; CMOS technology; Foundries; Production facilities; Project management; Risk management; Semiconductor device manufacture; Semiconductor devices; Testing; USA Councils;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference and Workshop, 2000 IEEE/SEMI
Conference_Location
Boston, MA
ISSN
1078-8743
Print_ISBN
0-7803-5921-6
Type
conf
DOI
10.1109/ASMC.2000.902579
Filename
902579
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