DocumentCode
2866720
Title
Fab automation-where´s the payback?
Author
Scott, Douglas
Author_Institution
PRI Autom., Billerica, MA, USA
fYear
2000
fDate
2000
Firstpage
168
Lastpage
174
Abstract
Historically, a lot of attention has been given to improving the physics, the chemistry and the process technologies used in semiconductor manufacturing. This focus has produced dramatic results. Since its inception, the semiconductor industry has achieved productivity improvements unmatched by any industry ever. Shrinking feature sizes, larger wafers, yield improvements and other productivity gains have contributed to this success. However, most of the known technological capabilities will be approaching or have reached their limits within 10-15 years. Already, larger wafers and improved yields are making a smaller contribution to productivity improvements than they have in the past, creating a widening gap in the productivity curve. Also, during the past decade, mass consumerization and commoditization of the electronics industry has put increasing pressure on the profit margins of semiconductor manufacturers. These pressures are increasing, just when the annual productivity benefits from larger wafers and improved yields are starting to decline. This paper discusses performance enablers which help close the gap in the productivity curve, and results that have been achieved
Keywords
computer integrated manufacturing; integrated circuit yield; process control; production control; stock control; annual productivity benefits; commoditization; fab automation; feature sizes; mass consumerization; productivity gains; productivity improvements; semiconductor manufacturing; yield improvements; Electronics industry; Logistics; Manufacturing automation; Manufacturing industries; Manufacturing processes; Metrology; Physics; Production facilities; Productivity; Semiconductor device manufacture;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference and Workshop, 2000 IEEE/SEMI
Conference_Location
Boston, MA
ISSN
1078-8743
Print_ISBN
0-7803-5921-6
Type
conf
DOI
10.1109/ASMC.2000.902581
Filename
902581
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