Title :
Thermal management for multi-phase current mode buck converters
Author :
Cao, Pearl ; Ng, Wai Tung ; Trescases, Olivier
Author_Institution :
Edward S. Rogers Sr. Electr. & Comput. Eng. Dept., Univ. of Toronto, Toronto, ON, Canada
Abstract :
This paper deals with thermal management and power sharing in multi-phase buck converters. In conventional designs, each phase is regulated to share the load current equally. However, due to variations in PCB layout, parasitic resistances, airflow, and transistor on-resistance (Ron), it is common to observe significant temperature variations between the converter phases, leading to reliability issues and suboptimal device utilization. Several past research efforts have demonstrated closed-loop analog and digital techniques to achieve a uniform temperature in all phases. In this work, a thermal management unit (TMU) with four independent linear controllers is proposed to regulate the phase temperatures in a four-phase mixed-signal peak-current mode converter. The digital TMU is designed based on a lumped thermal model of the system and dynamically adjusts the peak current in each phase to match the moving average temperature. Experimental results from a digitally controlled 12 V to 1 V, 50 A, 250 kHz four-phase peak current mode buck converter demonstrate the effectiveness of the proposed thermal management technique in the presence of uneven air flow and dynamic load currents.
Keywords :
digital control; power convertors; printed circuit layout; PCB layout; closed-loop analog technique; current 50 A; digital TMU; digital technique; four-phase mixed-signal peak-current mode converter; frequency 250 kHz; linear controller; multiphase current mode buck converter; thermal management unit; thermal model; transistor on-resistance; voltage 12 V to 1 V; Converters; Current measurement; Solid modeling; Temperature distribution; Temperature measurement; Temperature sensors; Transient analysis;
Conference_Titel :
Applied Power Electronics Conference and Exposition (APEC), 2011 Twenty-Sixth Annual IEEE
Conference_Location :
Fort Worth, TX
Print_ISBN :
978-1-4244-8084-5
DOI :
10.1109/APEC.2011.5744735