A new IGBT module for megawatt class 380VAC to 690VAC grid tie inverters

Author

Motto, Eric R. ; Donlon, John F.

Author_Institution

Powerex Inc., Youngwood, PA, USA

fYear

2011

fDate

6-11 March 2011

Firstpage

1306

Lastpage

1310

Abstract

This paper presents a new high power dual IGBT module package designed for megawatt class utility interface inverters operating in the 380VAC to 690VAC range. This new module utilizes the latest high efficiency power chips and features maximum current ratings of 2500A at 1200V or 1800A at 1700V. A new aluminum to aluminum nitride to aluminum direct bonded baseplate structure has been developed to increase reliability while reducing weight. The power chip layout has been optimized for efficient thermal management in both liquid and air cooled configurations. A novel four layer internal bus structure was developed to provide extremely low inductance for minimization of surge voltages. This paper will describe the design features, characteristics, and performance of this new module.

Keywords

aluminium compounds; insulated gate bipolar transistors; invertors; AlN; air cooled configurations; current 1800 A; current 2500 A; direct bonded baseplate structure; grid tie inverters; high power dual IGBT module package; liquid cooled configurations; megawatt class utility interface inverters; power chip layout; surge voltage minimization; thermal management; voltage 1200 V; voltage 1700 V; voltage 380 V; voltage 690 V; Aluminum; Inductance; Insulated gate bipolar transistors; Inverters; Layout; Logic gates; Reliability; Insulated gate bipolar transistors; Semiconductor module; Utility interface inverter;

fLanguage

English

Publisher

ieee

Conference_Titel

Applied Power Electronics Conference and Exposition (APEC), 2011 Twenty-Sixth Annual IEEE

Conference_Location

Fort Worth, TX

ISSN

1048-2334

Print_ISBN

978-1-4244-8084-5

Type

conf

DOI

10.1109/APEC.2011.5744762

Filename

5744762