Title :
Interconnect strategies for deep submicron CMOS manufacture
Author :
Mark, Christopher ; Rose, Kenneth
Author_Institution :
Center for Adv. Interconnect Sci. & Technol., Rensselaer Polytech. Inst., Troy, NY, USA
Abstract :
As CMOS chips are scaled to deep submicron dimensions, interconnect strategy remains a key gateway for performance and manufacturability. ITRS´99 projections seriously underestimate the number of wiring levels required, even though inductance effects can significantly reduce wiring level requirements. By examining the requirements for a Multimedia Internet Processor, we project more reasonable wiring level requirements. The effects of alternative interconnect materials are considered, and the importance of appropriate interconnect strategies is emphasized
Keywords :
CMOS integrated circuits; integrated circuit interconnections; BEOL manufacturing; ITRS´99; Multimedia Internet Processor; deep submicron CMOS chip; inductance; interconnect material; wiring level; Chip scale packaging; Clocks; Conducting materials; Frequency estimation; Guidelines; Inductance; Internet; Logic; Manufacturing processes; Wiring;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 2000 IEEE/SEMI
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-5921-6
DOI :
10.1109/ASMC.2000.902620