Title :
STM Crolles TPM deployments and success story
Author :
Ribes, Christian
Author_Institution :
R&D Dept., Centre Commun de Microelectron. de Crolles, France
Abstract :
The STMicroelectronics facility at Crolles develops and volume produces ASICs for CMOS and BICMOS processes on 200 mm wafers for technologies down to 0.12 μm. Given the wide range of products and processes, a high degree of manufacturing flexibility is required. A large-scale TPM (Total Productive Manufacturing) program was introduced in 1992 based on a comprehensive manufacturing strategy to improve equipment productivity
Keywords :
BiCMOS integrated circuits; CMOS integrated circuits; application specific integrated circuits; integrated circuit manufacture; 0.12 micron; 200 mm; ASIC fab; BICMOS process; CMOS process; Crolles; STMicroelectronics facility; equipment productivity; total productive manufacturing; volume production; BiCMOS integrated circuits; CMOS technology; Electric breakdown; Flexible manufacturing systems; Manufacturing processes; Production systems; Productivity; Quality management; Research and development; Total quality management;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 2000 IEEE/SEMI
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-5921-6
DOI :
10.1109/ASMC.2000.902626
