Title :
Using overall equipment effectiveness (OEE) and the equipment improvement process (ET) to improve Fab throughput
Author :
Freck, Robert W.
Author_Institution :
Resource Dynamics Int., Boca Raton, FL, USA
Abstract :
Total Productive Manufacturing has been used for many years as a tool to help Semiconductor companies improve Equipment reliability, involve the Workforce In Equipment care, improve the Maintenance function, and improve overall Fab cleanliness and Safety. Almost all chipmakers have one form or another of TPM in place. However, as with many improvement processes, many of the TPM promises have yet to be met. Even in mature TPM implementations, some serious questions need to be asked
Keywords :
semiconductor device manufacture; equipment improvement process; overall equipment effectiveness; semiconductor fab; throughput; total productive manufacturing; Electronics industry; Maintenance; Manufacturing processes; Product safety; Resource management; Safety devices; Semiconductor device manufacture; Semiconductor device reliability; Semiconductor materials; Throughput;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 2000 IEEE/SEMI
Conference_Location :
Boston, MA
Print_ISBN :
0-7803-5921-6
DOI :
10.1109/ASMC.2000.902631
