Hybrid silicon-organic packaged antenna array at 60 and 80 GHz using a low-cost bonding technique

This paper presents for the first time a hybrid silicon-organic packaged mm-wave antenna, that is flip-chip bonded to a 400 µm thick silicon substrate through gold bumps and a non-conductive film (NCF) adhesive layer. The antenna was made on RO3003™. Two different antennas were designed, at 60 and 80 GHz respectively. It is demonstrated that the silicon substrate can be successfully integrated into an organic package at mm-wave frequencies by securing it mechanically with the NCF layer. Both designs yielded over 15% bandwidth and greater than 10 dBi gain. Good agreement was found between simulation and measurements.