Title :
Two-phase thermosyphon device for the large thyristors cooling
Author :
Bordignon, P. ; Ragni, A. ; Latrofa, E. ; Casarosa, C.
Abstract :
An advanced device is presented for the cooling of large thyristors, using silicon wafers of 75 and 100 mm diameter and their dissipating auxiliary components, such as snubber resistors. The device takes advantage of the two-phase thermosyphon principle and is designed for forced-air cooling. Results obtained from tests on a few samples indicate that the technique is suitable for obtaining thermal control of even the largest thyristors, guaranteeing the full utilization of their current-handling capability.<>
Keywords :
cooling; heat sinks; thyristors; 100 mm; 75 mm; dissipating auxiliary components; forced-air cooling; heat sinks; snubber resistors; thermal control; thyristor cooling; two-phase thermosyphon principle; Costs; Electronics cooling; Heat sinks; Heat transfer; Resistors; Silicon; Snubbers; Testing; Thermal resistance; Thyristors;
Conference_Titel :
Power Electronics Specialists Conference, 1988. PESC '88 Record., 19th Annual IEEE
Conference_Location :
Kyoto, Japan
DOI :
10.1109/PESC.1988.18281
