DocumentCode :
2869373
Title :
The harsh environment robust micromechanical technology (HERMiT) program: Success and some unfinished business
Author :
Nguyen, Clark T -C
Author_Institution :
Dept. of EECS, Univ. of California at Berkeley, 94720, U.S.A.
fYear :
2012
fDate :
17-22 June 2012
Firstpage :
1
Lastpage :
3
Abstract :
This invited paper summarizes the history behind the creation, execution, and eventual success and commercial impact of DARPA´s Harsh Environment Robust Micromechani-cal Technology (HERMiT) program. Originally proposed in late 2002 as a program to explore micro-scale environmental control via new packaging technology, the HERMiT program morphed into a vehicle to explore and address reliability and long-term stability issues for microelectromechanical devices, such as RF switches, high-Q resonators, and gyroscopes. In the end, packag-ing indeed surfaced as an important key to achieving the best cycle lifetimes seen to date for RF MEMS switches, as well as unprecedented frequency stability for micromechanical resona-tors that eventually enabled some of the MEMS-based timing oscillator products now shipping in volumes approaching 100 million parts per year.
Keywords :
Indexes; Micromechanical devices; Radio frequency; Switches; RF MEMS switch; gyroscope; micromechanical resonator; reliability; stability; wafer-scale packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest (MTT), 2012 IEEE MTT-S International
Conference_Location :
Montreal, QC, Canada
ISSN :
0149-645X
Print_ISBN :
978-1-4673-1085-7
Electronic_ISBN :
0149-645X
Type :
conf
DOI :
10.1109/MWSYM.2012.6259750
Filename :
6259750
Link To Document :
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