Title :
Physical processes in micromachining of silicon by laser μ-jet
Author_Institution :
Laser X Co. Ltd., Aichi, Japan
Abstract :
To allow the production of small μm order microstructures, processing with the laser μ-jet has the unique characteristics of material removal process, but its industrial application has yet to be established. This paper describes creating fine patterned microstructure in silicon using this laser μ-jet and discusses various physical phenomenon that ultimately affect the quality of the end product and explores the possibilities of current and new application areas. The present results show much better cut quality compared with the conventional technique. Grating like grove structures were created with a line and pitch width below 100 μm
Keywords :
elemental semiconductors; laser beam machining; micromachining; silicon; Si; complex micromachined structure; cut quality; fine patterned microstructure; grating like grove structures; laser micro-jet; material removal process; micromachining; physical processes; small microstructures; stencil mask; Fiber lasers; Gratings; Laser beam cutting; Laser beams; Laser theory; Micromachining; Optical pulses; Semiconductor lasers; Silicon; Space vector pulse width modulation;
Conference_Titel :
Micromechatronics and Human Science, 2000. MHS 2000. Proceedings of 2000 International Symposium on
Conference_Location :
Nagoya
Print_ISBN :
0-7803-6498-8
DOI :
10.1109/MHS.2000.903288
