Title :
Comparative studies on interconnect techniques for RF applications
Author :
Yu, Yang ; Jian, Cai ; Shuidi, Wang ; Songliang, Jia
Author_Institution :
Inst. of Microelectron., Tsinghua Univ., Beijing, China
Abstract :
Interconnect techniques of wire bonding and flip chip are studied with their extracted lumped circuit models in this paper. With relatively complete considerations, they show similar electrical performance in RF range. The models are also applied to a RF-MEMS VCO design, flip chip exists better characteristics as chip-to-chip interconnect inside the package.
Keywords :
chip scale packaging; flip-chip devices; integrated circuit interconnections; lead bonding; lumped parameter networks; radiofrequency integrated circuits; RF applications; RF-MEMS VCO design; chip-to-chip interconnect; extracted lumped circuit models; flip chip; interconnect techniques; wire bonding; Bonding; Circuit simulation; Flip chip; Integrated circuit interconnections; Packaging; Radio frequency; Radiofrequency microelectromechanical systems; Voltage-controlled oscillators; Wire; Wireless communication;
Conference_Titel :
Microwave and Millimeter Wave Technology, 2004. ICMMT 4th International Conference on, Proceedings
Print_ISBN :
0-7803-8401-6
DOI :
10.1109/ICMMT.2004.1411594
