• DocumentCode
    2874333
  • Title

    Surface polishing of three dimensional micro structures

  • Author

    Lim, C.H. ; Kim, LT B. ; Lee, S.H. ; Lee, J.I. ; Kim, Z.J. ; Lee, S.J.

  • Author_Institution
    Dept. of Mech. Eng., Yonsei Univ., Seoul, South Korea
  • fYear
    2004
  • fDate
    2004
  • Firstpage
    709
  • Lastpage
    712
  • Abstract
    A new polishing technique for three dimensional micro structures using magnetorheological (MR) fluid is presented. Among various fabrication technologies of micro devices, some processes such as electroplating and wet etching which are widely used, give usually rough surface. However, there has been no polishing technique useful to micro structures, while various existing polishing methods are applicable only to flat surfaces or macro scaled structures. In this study, three dimensional micro channel structures generated by copper electroplating and silicon wet etching are polished efficiently using MR fluid. As a result of polishing of both structures, the average surface roughness cuts down to more than an order with little change of original geometries and the performance of both structures is noticeably improved.
  • Keywords
    electroplating; etching; magnetorheology; micromechanical devices; polishing; surface roughness; MEMS; MR fluid; copper electroplating; magnetorheological fluid; microelectromechanical system; silicon wet etching; surface polishing; surface roughness; three dimensional micro channel structures; three dimensional micro structures; Abrasives; Magnetic fields; Radio frequency; Rough surfaces; Silicon; Stress; Surface finishing; Surface resistance; Surface roughness; Wet etching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2004. 17th IEEE International Conference on. (MEMS)
  • Print_ISBN
    0-7803-8265-X
  • Type

    conf

  • DOI
    10.1109/MEMS.2004.1290683
  • Filename
    1290683