DocumentCode
2874333
Title
Surface polishing of three dimensional micro structures
Author
Lim, C.H. ; Kim, LT B. ; Lee, S.H. ; Lee, J.I. ; Kim, Z.J. ; Lee, S.J.
Author_Institution
Dept. of Mech. Eng., Yonsei Univ., Seoul, South Korea
fYear
2004
fDate
2004
Firstpage
709
Lastpage
712
Abstract
A new polishing technique for three dimensional micro structures using magnetorheological (MR) fluid is presented. Among various fabrication technologies of micro devices, some processes such as electroplating and wet etching which are widely used, give usually rough surface. However, there has been no polishing technique useful to micro structures, while various existing polishing methods are applicable only to flat surfaces or macro scaled structures. In this study, three dimensional micro channel structures generated by copper electroplating and silicon wet etching are polished efficiently using MR fluid. As a result of polishing of both structures, the average surface roughness cuts down to more than an order with little change of original geometries and the performance of both structures is noticeably improved.
Keywords
electroplating; etching; magnetorheology; micromechanical devices; polishing; surface roughness; MEMS; MR fluid; copper electroplating; magnetorheological fluid; microelectromechanical system; silicon wet etching; surface polishing; surface roughness; three dimensional micro channel structures; three dimensional micro structures; Abrasives; Magnetic fields; Radio frequency; Rough surfaces; Silicon; Stress; Surface finishing; Surface resistance; Surface roughness; Wet etching;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2004. 17th IEEE International Conference on. (MEMS)
Print_ISBN
0-7803-8265-X
Type
conf
DOI
10.1109/MEMS.2004.1290683
Filename
1290683
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