DocumentCode
2874449
Title
Novel ultra tough organic low-k dielectrics
Author
Aoi, Nobuo ; Fukuda, Takuya ; Yanazawa, Hiroshi
Author_Institution
Matsushita Electr. Ind. Co. Ltd., Kyoto, Japan
fYear
2004
fDate
26-28 July 2004
Firstpage
121
Lastpage
122
Abstract
We have proposed an ultra tough low-k film with a low density and highly cross-linked structure realized by a co-polymerization of a 3-dimensional rigid monomer and a 2-dimensional rigid monomer with self-organized nanospace formation. This approach for syntheses of organic low-k materials promise some emerging ultra tough and ultra low-k organic dielectrics and a breakthrough for red brick wall against ITRS road map.
Keywords
low-k dielectric thin films; organic semiconductors; polymerisation; self-assembly; co-polymerization; cross-linked structure; organic low-k dielectrics; rigid monomer; self-organized nanospace formation; ultra tough dielectrics; Capacitance; Dielectric constant; Dielectric materials; Electronics industry; Finite element methods; Industrial electronics; Orbital calculations; Polymer films; Semiconductor films; Semiconductor materials;
fLanguage
English
Publisher
ieee
Conference_Titel
Future of Electron Devices, 2004. International Meeting for
Print_ISBN
0-7803-8423-7
Electronic_ISBN
0-7803-8424-5
Type
conf
DOI
10.1109/IMFEDK.2004.1566438
Filename
1566438
Link To Document