Title :
Polymer flip-chip bonding of pressure sensors on flexible Kapton film for neonatal catheters
Author :
Li, Chunyan ; Sauser, Frank E. ; Azizkhan, Richard ; Ahn, Chong H. ; Papautsky, Ian
Author_Institution :
Dept. of Electr. & Comput. Eng. & Comput. Sci., Cincinnati Univ., OH, USA
Abstract :
A new polymer flip-chip bonding method on a flexible Kapton film has been developed and applied to dual lumen neonatal catheters integrated with silicon micro pressure sensors. This polymer flip-chip bonding technique requires a low temperature process, which is very desirable for mounting microsensors or microactuators on flexible polymer substrates for medical applications. The silicon micro pressure sensors, which are mounted on a flexible Kapton film with metal lines for neonatal catheter, have been fully characterized in both gas and liquid.
Keywords :
bonding processes; catheters; elemental semiconductors; flip-chip devices; microactuators; microsensors; piezoresistive devices; polymer films; pressure sensors; silicon; Si; flexible Kapton film; microactuators; neonatal catheters; piezoresistive devices; polymer flip-chip bonding; polymer substrates; silicon micropressure sensors; Bonding; Catheters; Microactuators; Microsensors; Pediatrics; Polymer films; Semiconductor films; Sensor phenomena and characterization; Silicon; Temperature sensors;
Conference_Titel :
Micro Electro Mechanical Systems, 2004. 17th IEEE International Conference on. (MEMS)
Print_ISBN :
0-7803-8265-X
DOI :
10.1109/MEMS.2004.1290693
