DocumentCode
2874520
Title
Contextual Spectrums in Technology and Information Platform
Author
Shan, Tony C. ; Hua, Winnie W.
fYear
2006
fDate
18-22 Sept. 2006
Firstpage
508
Lastpage
508
Abstract
Summary form only given. The technology and information platform (TIP) is a three-dimensional architecture framework to effectively cope with the architecture complexity and manage the architectural assets of information system applications in a service-oriented paradigm. This holistic framework comprises the generic architecture stack (GAS), which is made up of a series of architecture layers, and the contextual spectrums, which consist of the process, abstraction, latitude, and maturity (PALM) dimensions. This paper describes the detailed attributes in the four dimensions of the contextual spectrums. The process dimension covers operations, risk, financial, resources, estimation, planning, execution, policies, governance, compliance, organizational politics, etc. The abstraction dimension deals with what, why, who, where, when, which and how (6W+1H). The latitude dimension includes principles, functional, logical, physical, interface, integration & interoperability, access & delivery, security, quality of services, patterns, standards, tools, skills, and so forth. Finally the maturity dimension is about performance, metrics, competitive assessment, scorecards, capacity maturity, benchmarks, service management, productivity, gap analysis, transition, etc
Keywords
business data processing; software architecture; abstraction dimension; contextual spectrum; generic architecture stack; information platform; information system application; latitude dimension; maturity dimension; service-oriented paradigm; technology platform; three-dimensional architecture framework; Asset management; Computer architecture; Context-aware services; Large-scale systems; Management information systems; Process planning; Productivity; Quality of service; Security; Technology management;
fLanguage
English
Publisher
ieee
Conference_Titel
Services Computing, 2006. SCC '06. IEEE International Conference on
Conference_Location
Chicago, IL
Print_ISBN
0-7695-2670-5
Type
conf
DOI
10.1109/SCC.2006.37
Filename
4026972
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