Title :
The effect of hydrogenous species on the properties and reliability of the dielectrics and metals used in multilevel metallization
Author :
Murarka, Shyam P.
Author_Institution :
Rensselaer Polytechnic institute
Keywords :
Annealing; Chemical vapor deposition; Dielectrics; Electromigration; Gold; Hydrogen; Impurities; Mechanical factors; Metallization; Silicon;
Conference_Titel :
Electron Devices and Materials Symposium, 1994. EDMS 1994. 1994 International
DOI :
10.1109/EDMS.1994.771269
