Title :
New metal structure by sidewall encapsulation method
Author :
Kim, Eungsoo ; Shim, Sang-Chul ; Cho, Kyung-Won ; Lim, Soon-Kwon ; Choi, Kyu-hyun
Author_Institution :
Samsung Electronics Co., Ltd.
Keywords :
Artificial intelligence; Degradation; Encapsulation; Etching; Intermetallic; Samarium; Scanning electron microscopy; Temperature; Testing; Tin;
Conference_Titel :
Electron Devices and Materials Symposium, 1994. EDMS 1994. 1994 International
DOI :
10.1109/EDMS.1994.771271
