High-performance liquid metal cooling loops

Author

Ghoshal, U. ; Grimm, D. ; Ibrani, S. ; Johnston, C. ; Miner, A.

Author_Institution

nanoCoolers, Inc., Austin, TX, USA

fYear

2005

fDate

15-17 March 2005

Firstpage

16

Lastpage

19

Abstract

We present a single-phase liquid cooling technology that exploits the highly conducting nature and superior thermophysical properties of liquid metals to cool high density power sources (>200 Wcm^-2) with very high heat transfer coefficients (∼20 Wcm^-2K^-1), and pump the liquid metals using power-efficient, non-moving, gravity/orientation independent magnetofluiddynamic (MFD) pumps. We have implemented and characterized this cooling scheme using miniature (<5 cm³) pumps operating at 25 kPa maximum pressure head and 10% efficiencies in a variety of computing applications including mobile notebooks, desktops, and servers.

Keywords

cooling; fluid dynamics; integrated circuit packaging; liquid metals; magnetic fluids; pumps; thermal management (packaging); 10 percent; 25 kPa; GaIn; MFD; gravity/orientation independent pumps; heat transfer coefficients; high density power source cooling; high power density processors; liquid metal cooling loops; magnetofluiddynamic pumps; miniature pumps; power-efficient nonmoving pumps; pump efficiency; pump maximum pressure head; single-phase liquid cooling technology; thermal management; Electronics cooling; Fluid flow; Heat pumps; Heat transfer; Kinematics; Magnetic properties; Resistance heating; Thermal conductivity; Viscosity; Water heating;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE

ISSN

1065-2221

Print_ISBN

0-7803-8985-9

Type

conf

DOI

10.1109/STHERM.2005.1412153

Filename

1412153