Title :
Evaluation of high performance thermal greases for CPU package cooling applications
Author :
Stern, Margaret B. ; Gektin, Vadim ; Pecavar, Stanley ; Kearns, Donald ; Chen, Tony
Author_Institution :
Sun Microsystems, Inc, San Diego, CA, USA
Abstract :
High performance thermal greases have been evaluated in three separate environments: ideal laboratory, in situ laboratory, and system mockup testing to better understand how bulk and interfacial thermal properties, in combination with the test vehicles used, effect the resultant thermal performance. The three methodologies are described and measurements on a baseline material reported.
Keywords :
cooling; greases; integrated circuit packaging; thermal conductivity; thermal management (packaging); thermal resistance; BLT; CPU package cooling; TIM; bondline thickness; bulk thermal properties; high performance thermal greases; interfacial thermal properties; thermal characterization; thermal conductivity; thermal interface material; thermal resistance; Conducting materials; Cooling; Electrical resistance measurement; Electronic packaging thermal management; Laboratories; Surface resistance; System testing; Thermal conductivity; Thermal resistance; Thermal stresses;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE
Print_ISBN :
0-7803-8985-9
DOI :
10.1109/STHERM.2005.1412157
