DocumentCode :
2875597
Title :
Experimental characterization of pressure loss through EMI shields and 1RU card passages in dense electronic enclosures
Author :
Akella, Chakravarthy ; Ortega, Alfonso
Author_Institution :
Dept. of Aerosp. & Mech. Eng., Arizona Univ., Tucson, AZ, USA
fYear :
2005
fDate :
15-17 March 2005
Firstpage :
86
Lastpage :
93
Abstract :
Experimental measurements were made of the overall pressure loss coefficients of individual EMI shield samples and various printed circuit boards in a 1RU channel. The loss coefficients of the boards were highly dependent on electronic component population density. The loss coefficients of the grill samples compared surprisingly well with literature data for perforated plates, despite being taken at much lower Reynolds number than the literature data. Assemblies of printed circuit boards with upstream and downstream grills were predicted well by a 1D flow network model, but it appears that the upstream grill may influence the losses across the downstream board. The individually measured loss coefficients were used in a flow network model of an entire 9RU enclosure, with and without a fan tray present. The 1D predictions were generally adequate, except in the case with a deadlocked fan tray placed in front of the exit grill. This may be because the fan tray has a significant influence on the loss coefficient of the exit grill. The data generally showed that turbulence and flow non-uniformity generated by upstream components may influence the loss coefficients of downstream components. These interactions are generally not captured by standard 1D modeling approaches.
Keywords :
cooling; electromagnetic interference; electromagnetic shielding; electronics packaging; pressure measurement; printed circuits; turbulence; 1RU card passages; 9RU enclosure; EMI shields; air cooling; dense electronic enclosures; electronic component population density; fan tray; flow nonuniformity; pressure loss coefficients; printed circuit boards; turbulence; Computational fluid dynamics; Computational modeling; Electromagnetic interference; Heat engines; Impedance; Laboratories; Loss measurement; Pressure measurement; Printed circuits; Thermal management of electronics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE
ISSN :
1065-2221
Print_ISBN :
0-7803-8985-9
Type :
conf
DOI :
10.1109/STHERM.2005.1412163
Filename :
1412163
Link To Document :
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