Title :
64-bit server cooling requirements
Author_Institution :
Packaging Technol. Res., Fujitsu Labs. of America, Sunnyvale, CA, USA
Abstract :
Cooling of 64-bit servers is constrained by increasing power and decreasing space. Power dissipation of high performance processors is predicted to increase linearly over the next decade. Thermal interface, heat spreading and heatsink-to-ambient convection each provide similar resistances in the thermal path from chip to ambient. One departure from previous practice will be the increasing sensitivity of power dissipation with junction temperature. As leakage current, previously a small contribution to total power dissipation, becomes significant, chip power dissipation will become a stronger function of temperature. Expenditure of energy on enhanced cooling, such as pumped water or vapor-cycle refrigeration, may result in reduced total system power. Recent advances in thermoelectrics could change many assumptions in refrigeration, enabling distributed and localized refrigeration at the processor level with minimum space requirements.
Keywords :
cooling; microprocessor chips; power consumption; refrigeration; 64 bit; 64-bit servers; chip power dissipation; high performance processors; junction temperature; leakage current; processor refrigeration; pumped water cooling; server cooling; thermoelectrics; vapor-cycle refrigeration; Cooling; Packaging; Power dissipation; Power distribution; Refrigeration; Resistance heating; Space technology; Temperature sensors; Thermal conductivity; Thermal resistance;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE
Print_ISBN :
0-7803-8985-9
DOI :
10.1109/STHERM.2005.1412164