Title :
Multivariate moment matching for generating boundary condition independent compact dynamic thermal networks of packages [BGA example]
Author :
Codecasa, Lorenzo ; D´Amore, Dario ; Maffezzoni, Paolo
Author_Institution :
Dipt. di Elettronica e Informazione, Politecnico di Milano, Milan, Italy
Abstract :
A novel approach is proposed for generating compact dynamic thermal models of packages, independent of boundary conditions. This approach is based on the novel definition of Robin´s boundary condition independent dynamic thermal network and on the application of a novel multivariate moment matching method. The resulting compact thermal models are more accurate than compact models obtained by means of previous methods.
Keywords :
Galerkin method; ball grid arrays; integrated circuit modelling; integrated circuit packaging; method of moments; multivariable systems; thermal management (packaging); BGA packages; Galerkin method; Robin dynamic thermal networks; boundary condition independence; multivariate moment matching; package compact dynamic thermal networks; thermal models; Boundary conditions; Capacitance; Disruption tolerant networking; Electronic mail; Equations; Moment methods; Network topology; Packaging; Partitioning algorithms; Thermal resistance;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE
Print_ISBN :
0-7803-8985-9
DOI :
10.1109/STHERM.2005.1412175
