Title :
Flat plate loop heat pipe with a novel evaporator structure
Author :
Meng-Chang Tsai ; Chun-Sheng Yu ; Shung-Wen Kang
Author_Institution :
Dept. of Mech. & Electro-Mech. Eng., Tamkang Univ., Tamsui, Taiwan
Abstract :
The paper proposes the fabrication and test of flat plate loop heat pipe (FPLHP) with a novel evaporator structure. The IC industry of Taiwan, ROC is one of the most competitive industries in the world. With the increase in electric heat dissipation and miniaturization, we need advanced cooling systems to solve the high temperature problems. We describe the evaporator design and a new stretched design. Finally, the test results show that the new design of FPLHP works very well.
Keywords :
cooling; evaporation; heat pipes; integrated circuit packaging; microprocessor chips; advanced cooling systems; computer chips; electric heat dissipation; evaporator structure; flat plate loop heat pipe; high temperature problems; miniaturization; Copper; Electronics cooling; Fabrication; Heat engines; Heat sinks; NASA; Refrigeration; Resistance heating; Temperature; Testing;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-8985-9
DOI :
10.1109/STHERM.2005.1412177
