Title :
Thermal performance of water-cooled heat sinks: a comparison of two different designs
Author :
Salem, T.E. ; Porschet, D. ; Bayne, S.B.
Author_Institution :
Dept. of Electr. Eng., US Naval Acad., Annapolis, MD, USA
Abstract :
As power electronic applications continue to switch higher levels of voltage and current in smaller-sized component packages, the resulting increase in power density requires efficient thermal management. This paper compares the thermal performance for operating a MOSFET on a water-cooled pole-arrayed heat sink versus a novel water-cooled microchannel heat sink. Details are presented on an innovative technique for determining the thermal capacitance modeling parameter for the heat sinks from experimental data.
Keywords :
cooling; heat sinks; power MOSFET; thermal management (packaging); thermal resistance; MOSFET; component packages; microchannel heat sink; pole-arrayed heat sink; power density; power electronic applications; thermal capacitance modeling parameter; thermal management; thermal performance; water-cooled heat sinks; Electronic packaging thermal management; Energy management; Heat sinks; MOSFET circuits; Power electronics; Switches; Thermal management; Thermal management of electronics; Voltage; Water heating;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE
Print_ISBN :
0-7803-8985-9
DOI :
10.1109/STHERM.2005.1412190
