DocumentCode
2876313
Title
Thermal characterization of vertically-oriented carbon nanotubes on silicon
Author
Hu, Xuejiao ; Padilla, Antonio A. ; Xu, Jun ; Fisher, Timothy S. ; Goodson, Kenneth E.
Author_Institution
Dept. of Mech. Eng., Stanford Univ., CA, USA
fYear
2005
fDate
15-17 March 2005
Firstpage
292
Lastpage
297
Abstract
An exploratory thermal interface structure, made of vertically oriented carbon nanotubes directly grown on a silicon substrate, has been thermally characterized using a 3-omega method. The effective thermal conductivities of the CNT sample, including the effects of voids, are found to be 74 W/m·K to 83 W/m·K in the temperature range of 295K to 323K, one order higher than that of the best thermal greases or phase change materials. This suggests that the vertically oriented CNT potentially can be a promising next-generation thermal interface solution. However, fairly large thermal resistances were observed at the interfaces between the CNT samples and the experimental contact. Minimizing these contact resistances is critical for the application of these materials.
Keywords
carbon nanotubes; nanotechnology; silicon; thermal conductivity; thermal management (packaging); thermal resistance; 295 to 323 K; 3-omega method; CNT sample; contact resistances; effective thermal conductivities; next-generation thermal interface; silicon substrate; thermal resistances; vertically oriented carbon nanotubes; voids; Bridge circuits; Carbon nanotubes; Conducting materials; Electric resistance; Electronic packaging thermal management; Resistance heating; Silicon; Thermal conductivity; Thermal management; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE
ISSN
1065-2221
Print_ISBN
0-7803-8985-9
Type
conf
DOI
10.1109/STHERM.2005.1412194
Filename
1412194
Link To Document