Thermal characterization of high performance MCP with silicon spacer having low thermal impedance

Author

Lee, Haehyung ; Park, Sangwook ; Baek, Joonghyun ; Lee, Jinyang ; Lee, Dongho ; Oh, Seyong

Author_Institution

Samsung Electron. Co., LTD, Gyeonggi-Do, South Korea

fYear

2005

fDate

15-17 March 2005

Firstpage

322

Lastpage

326

Abstract

This paper presents the thermal optimization of a thermally enhanced FBGA MCP (multichip package). Because of insufficient heat path from top chip to PCB, heat is trapped between chips as shown in computer simulations. To solve the heat trap problem, we designed and developed a thermally enhanced MCP with a silicon spacer, which was applied to a 144 FBGA MCP. An experiment was carried out to verify the thermal characteristics of the thermally enhanced MCP, concerning structural variation and replacement of the adhesive. The experimental results showed that the thermal resistance of the MCP is improved and the low thermal conductive adhesive material is an important heat path barrier.

Keywords

adhesives; ball grid arrays; circuit optimisation; integrated circuit packaging; thermal management (packaging); thermal resistance; MCP thermal characterization; heat trap; low thermal conductive adhesive; low thermal impedance spacer; silicon spacer; thermal optimization; thermal resistance; thermally enhanced FBGA; top chip/PCB heat path; Computer simulation; Conducting materials; Conductive adhesives; Impedance; Packaging; Resistance heating; Silicon; Space heating; Thermal conductivity; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE

ISSN

1065-2221

Print_ISBN

0-7803-8985-9

Type

conf

DOI

10.1109/STHERM.2005.1412199

Filename

1412199