DocumentCode
2876510
Title
On-chip liquid cooling with integrated pump technology
Author
Oprins, H. ; Nicole, C.C.S. ; Baret, J.C. ; Van der Veken, G. ; Lasance, C. ; Baelmans, M.
Author_Institution
Dept. of Mech. Eng., Katholieke Univ., Leuven, Belgium
fYear
2005
fDate
15-17 March 2005
Firstpage
347
Lastpage
353
Abstract
In this paper, the capability of a novel cooling system for microchannels based on the principle of electrowetting is examined. To start with, the electrowetting effect in microchannels is experimentally investigated. Next, based upon these results, the cooling capacity of the proposed system is theoretically investigated. It can be concluded that the proposed system is promising, especially when frequencies in the range of a few Hz can be achieved.
Keywords
cooling; integrated circuit packaging; microfluidics; micropumps; thermal management (packaging); wetting; cooling capacity; electrowetting effect; forced convection microchannel liquid cooling; integrated cooling system; integrated pump technology; microchannel cooling system; on-chip liquid cooling; Dielectric liquids; Electronics cooling; Filling; Heat transfer; Liquid cooling; Microchannel; Silicon; Temperature; Thermal conductivity; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 2005 IEEE Twenty First Annual IEEE
ISSN
1065-2221
Print_ISBN
0-7803-8985-9
Type
conf
DOI
10.1109/STHERM.2005.1412203
Filename
1412203
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