DocumentCode
2876746
Title
A novel method to analyze analog and mixed mode IC failure by Soft Defect Localization (SDL)
Author
Li, Jinglong ; Zhai, Linda ; Wang, Winter ; Motohiko, Masuda ; Fan, Bird ; Zhang, Andy
Author_Institution
Freescale Semicond. (China) Ltd., Tianjin, China
fYear
2011
fDate
4-7 July 2011
Firstpage
1
Lastpage
4
Abstract
In semiconductor failure analysis, Soft Defect Localization (SDL) technology is applied to localize defect that dependent on conditions such as temperature, frequency, voltage. SDL is usually used for digital failure analysis. However, to directly apply SDL in analog part is not so common. In this paper, a novel method is introduced to analyze analog signal failure at high temperature by SDL technology.
Keywords
failure analysis; integrated circuit reliability; monolithic integrated circuits; analog signal failure; digital failure analysis; frequency; high temperature; mixed mode IC failure; semiconductor failure analysis; soft defect localization technology; voltage; Failure analysis; Heating; Integrated circuits; Lasers; Oscilloscopes; Synchronization; Temperature sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2011 18th IEEE International Symposium on the
Conference_Location
Incheon
ISSN
1946-1542
Print_ISBN
978-1-4577-0159-7
Electronic_ISBN
1946-1542
Type
conf
DOI
10.1109/IPFA.2011.5992712
Filename
5992712
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