Title :
A novel method to analyze analog and mixed mode IC failure by Soft Defect Localization (SDL)
Author :
Li, Jinglong ; Zhai, Linda ; Wang, Winter ; Motohiko, Masuda ; Fan, Bird ; Zhang, Andy
Author_Institution :
Freescale Semicond. (China) Ltd., Tianjin, China
Abstract :
In semiconductor failure analysis, Soft Defect Localization (SDL) technology is applied to localize defect that dependent on conditions such as temperature, frequency, voltage. SDL is usually used for digital failure analysis. However, to directly apply SDL in analog part is not so common. In this paper, a novel method is introduced to analyze analog signal failure at high temperature by SDL technology.
Keywords :
failure analysis; integrated circuit reliability; monolithic integrated circuits; analog signal failure; digital failure analysis; frequency; high temperature; mixed mode IC failure; semiconductor failure analysis; soft defect localization technology; voltage; Failure analysis; Heating; Integrated circuits; Lasers; Oscilloscopes; Synchronization; Temperature sensors;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2011 18th IEEE International Symposium on the
Conference_Location :
Incheon
Print_ISBN :
978-1-4577-0159-7
Electronic_ISBN :
1946-1542
DOI :
10.1109/IPFA.2011.5992712
