DocumentCode :
2876795
Title :
High Performance RF MEMS Series Contact Switch - Design and Simulations
Author :
Liu, Lianjun
Author_Institution :
Freescale Semicond., Tempe
fYear :
2007
fDate :
May 29 2007-June 1 2007
Firstpage :
158
Lastpage :
164
Abstract :
In this paper, we present a detailed discussion of the design and simulation of a RF MEMS contact switch. Process-induced stress effects are discussed and included in the simulations. The advantage of the design is described by comparing its static characteristics with that of a simple cantilever switch device. When comparing to a typical cantilever switch, this MEMS switch design is unique in the following aspects: 1) the dielectric cantilever, together with the top electrostatic electrode, extends beyond the metal shorting bar; and 2) the metal shorting bar, instead of being an insulated metal line attached to the bottom of the dielectric cantilever, is at one end permanently fixed (and electrically connected) to either the RF signal input or output trace. The connection is made through etching a via (side-contact) in the sacrificial layer on top of the RF signal line trace and overlapping the shorting-bar metal line with the via (side-contact) opening. The shorting-bar side contact decreases the stress-induced cantilever bending and therefore improves stability with regard to stress and temperature. It also reduces the number of necessary switch contacts from two to one, resulting in lower contact resistance and better device reliability. The use of an extended actuation cantilever design leads to a large and stable contact area at high actuation voltages. This, combined with the single contact feature enabled by the side contact design, results in a high performance MEMS series contact switch. The measured switch DC resistance is <1Omega with insertion loss <0.3 dB and isolation >25 dB up to 40 GHz.
Keywords :
cantilevers; microswitches; stress effects; DC resistance measurement; RF MEMS series contact switch-design; RF signal line trace; dielectric cantilever; electrostatic electrodes; etching; extended actuation cantilever design; process-induced stress effects; sacrificial layer; shorting-bar metal line; Contacts; Dielectrics and electrical insulation; Electrodes; Electrostatics; Etching; Microswitches; Radiofrequency microelectromechanical systems; Signal design; Stress; Switches;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Conference_Location :
Reno, NV
ISSN :
0569-5503
Print_ISBN :
1-4244-0985-3
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2007.373791
Filename :
4249877
Link To Document :
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