Thermal analysis of high power LEDs at working conditions

Author

Jang, S.H. ; Shin, M.W.

Author_Institution

Dept. of Mater. Sci. & Eng., Myong Ji Univ., Yongin, South Korea

fYear

2011

fDate

4-7 July 2011

Firstpage

1

Lastpage

3

Abstract

In this paper, we present the thermal analysis of high-power light-emitting diodes (LEDs) with under the real operating conditions. Thermal transient measurements were performed to study the thermal characteristics of high power LED packages. The effects of working conditions such as the ambient temperature, working time, cooling element, and the applied pressure on the thermal performance of high power LED package were investigated. The results indicate that the design with thermal characteristic is imperative for reliable operation of the high power LED package.

Keywords

cooling; electronics packaging; light emitting diodes; reliability; thermal analysis; ambient temperature; cooling element; high-power LED package; light-emitting diodes; real operating conditions; reliable operation; thermal analysis; thermal transient; working time; Cooling; Employee welfare; Junctions; Light emitting diodes; Temperature; Temperature measurement; Thermal analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits (IPFA), 2011 18th IEEE International Symposium on the

Conference_Location

Incheon

ISSN

1946-1542

Print_ISBN

978-1-4577-0159-7

Electronic_ISBN

1946-1542

Type

conf

DOI

10.1109/IPFA.2011.5992721

Filename

5992721