Whitening phenomena between polyphthalamide sidewall and silicone encapsulant in the light-emitting diode package

Author

Lee, Kwang-Cheol ; Kim, Sang-Mook ; Oh, Hwa-Sub ; Baek, Jong Hyeob

Author_Institution

Korea Photonics Technol. Inst., Gwangju, South Korea

fYear

2011

fDate

4-7 July 2011

Firstpage

1

Lastpage

3

Abstract

White light-emitting diode (LED) packages are generally comprised of pre-mold leadframe, chip, wire, phosphor and encapsulant. During the high junction temperature operation, the whitening phenomena sometimes happen between leadframe sidewall and encapsulant resin. The nontrivial decrease of luminous flux results from the whitening originated from the decomposition mixture between polyphthalamide (PPA) sidewall and silicone resin.

Keywords

electronics packaging; light emitting diodes; resins; silicones; chip; decomposition mixture; encapsulant resin; high junction temperature operation; leadframe sidewall; luminous flux; phosphor; polyphthalamide sidewall; pre-mold leadframe; silicone encapsulant; silicone resin; white light-emitting diode packages; whitening phenomena; wire; Degradation; Delamination; Junctions; Lead; Life estimation; Light emitting diodes; Phosphors;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits (IPFA), 2011 18th IEEE International Symposium on the

Conference_Location

Incheon

ISSN

1946-1542

Print_ISBN

978-1-4577-0159-7

Electronic_ISBN

1946-1542

Type

conf

DOI

10.1109/IPFA.2011.5992729

Filename

5992729