Application of X-Ray MicroCT for non-destructive failure analysis and package construction characterization

Author

Cason, Morgan ; Estrada, Raleigh

Author_Institution

STMicroelectronics, Agrate Brianza, Italy

fYear

2011

fDate

4-7 July 2011

Firstpage

1

Lastpage

6

Abstract

Several of the critical drawbacks to existing failure analysis imaging techniques, including the low resolution of common non-destructive techniques and the destructiveness and slow speed of FIB/SEM, can be resolved by using X-Ray Micro Computed Tomography (MicroCT) as a complementary technique. In this the paper, we describe examples of the use of X-Ray MicroCT following TDR as non-destructive technique to isolate solderability and bump void failure mechanisms. Also, use of X-Ray MicroCT for package construction analysis is described.

Keywords

X-ray microscopy; computerised tomography; electronics packaging; failure analysis; focused ion beam technology; lead bonding; scanning electron microscopy; soldering; FIB; SEM; TDR; X-ray microCT; X-ray microcomputed tomography; failure analysis imaging technique; nondestructive failure analysis; package construction characterization; solderability isolation; void failure mechanism; wire bonding; Computer aided software engineering; Failure analysis; Scanning electron microscopy; Substrates; Three dimensional displays; Wires; X-ray imaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits (IPFA), 2011 18th IEEE International Symposium on the

Conference_Location

Incheon

ISSN

1946-1542

Print_ISBN

978-1-4577-0159-7

Electronic_ISBN

1946-1542

Type

conf

DOI

10.1109/IPFA.2011.5992732

Filename

5992732