• DocumentCode
    2877100
  • Title

    Analysis of the Impact of Polyimide Coating on Passivation Reliability by Simulation

  • Author

    Qiuxiao Qian

  • Author_Institution
    Suzhou, Suzhou
  • fYear
    2007
  • fDate
    May 29 2007-June 1 2007
  • Firstpage
    264
  • Lastpage
    268
  • Abstract
    In this paper, an advanced 3D FEA model framework with global and local sub-model is developed to investigate the impact of the polyimide coating on passivation reliability. The modeling work consists of two parts: the first part is the transient thermal simulation under a power pulse. The second part is the thermal mechanical stress simulation with the transient temperature input from the first part. Modeling and a small amount of empirical tests are conducted to evaluate the polyimide coating´s impact to passivation. The highlights of this work include consideration of silica fillers in mold compound which penetrate through a thin polyimide coating and contact the passivation or being embedded in the passivation slot to show its impact to passivation. Dynamic power pulse modeling shows that the passivation stress is induced by mismatch thermal expansion and temperature gradients generated by power pulses. A modeling DOE scheme, which considers different polyimide thickness, ideal models vs actual models, silica fillers penetrating the polyimide layer, and silica fillers contacting passivation, is fully investigated and studied. The results show the optimal solution with the minimum stress on passivation, which can help to improve the reliability of product, reduce costs in product development and maximize the robustness of our products.
  • Keywords
    cost reduction; design of experiments; passivation; polymer films; product development; semiconductor device manufacture; semiconductor device reliability; silicon compounds; thermal expansion; thermal stresses; advanced 3D FEA model; cost reduction; design of experiment; dynamic power pulse modeling; mold compound; passivation reliability; passivation stress; polyimide coating; product development; silica fillers; temperature gradients; thermal expansion; thermal mechanical stress simulation; transient thermal simulation; Analytical models; Coatings; Passivation; Polyimides; Power generation; Silicon compounds; Temperature; Testing; Thermal expansion; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
  • Conference_Location
    Reno, NV
  • ISSN
    0569-5503
  • Print_ISBN
    1-4244-0985-3
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2007.373807
  • Filename
    4249893