Chip-last Embedded Active for System-On-Package (SOP)

Embedded active technology, in which thinned active chips are directly buried into a core or high-density-interconnect layers, is gaining more interest for ultra-miniaturization, increased functionality and better performance of SOP (system-on-package). In this study, chip-last embedded active concept is proposed to address some of process and reliability issues that current chip-first and chip-middle embedded active approaches have. The detailed process development for the first prototype of chip-last embedded active is described in this paper.