I/O Decoupling in High Speed Packages Using Embedded Planar Capacitors

Embedded passives are gaining in importance due to the reduction in size of consumer electronic products. Embedded passives are gradually replacing discretes due to the miniaturization of electronic products. Integration of these passives within the package increases the real estate for active components. This would increase the functionality of the system. Among the passives, capacitors pose the biggest challenge due to the large capacitance required for decoupling high performance circuits. This paper will highlight the performance of DuPont´s planar embedded capacitor laminates in organic packages to provide I/O decoupling for active circuits.