DocumentCode
2877179
Title
HIGH PERFORMANCE PIN ELECTRONICS EMPLOYING GaAs IC AND HYBRID CIRCUIT PACKAGING TECHNOLOGY
Author
Baril, Barry ; Clayson, Dan ; McCracken, David ; Taylor, Stewart
fYear
1991
fDate
26-30 Oct 1991
Firstpage
777
Keywords
Bandwidth; Circuit testing; Driver circuits; Electronic equipment testing; Electronic packaging thermal management; Electronics packaging; Gallium arsenide; Hybrid integrated circuits; Integrated circuit packaging; System testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1991, Proceedings., International
ISSN
1089-3539
Print_ISBN
0-8186-9156-5
Type
conf
DOI
10.1109/TEST.1991.519743
Filename
519743
Link To Document