DocumentCode
2877182
Title
Failure isolation using FIB assist Photon Emission Microscopy analysis and microprobe analysis
Author
Wen, Gaojie ; Liu, Binghai ; Wang, Winter ; Li, Jinglong ; Tian, Li ; Wang, Xuezhu
Author_Institution
Freescale Semicond. (China) Ltd., Tianjin, China
fYear
2011
fDate
4-7 July 2011
Firstpage
1
Lastpage
4
Abstract
OBIRCH/EMMI and microprobe analysis were widely used to isolate failed device. But routine failure isolation method may not find the leakage path on some special functional failure cases. Two cases were presented to show a useful failure isolation strategy-FIB assisted photon emission analysis and microprobe by performing simulation or removing the load effect.
Keywords
failure analysis; focused ion beam technology; integrated circuit reliability; FIB assist photon emission microscopy analysis; OBIRCH-EMMI; focused ion beam; microprobe analysis; routine failure isolation method; Failure analysis; Integrated circuit modeling; Layout; Metals; Performance evaluation; Photonics; Semiconductor device measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2011 18th IEEE International Symposium on the
Conference_Location
Incheon
ISSN
1946-1542
Print_ISBN
978-1-4577-0159-7
Electronic_ISBN
1946-1542
Type
conf
DOI
10.1109/IPFA.2011.5992737
Filename
5992737
Link To Document