DocumentCode
2877533
Title
Lead free solder paste containing SnAgBiIn alloy: a preliminary study
Author
Liu, Y. ; Wang, X.B.
Author_Institution
Kester, Litton Components Pte Ltd, Singapore, Singapore
fYear
2004
fDate
2004
Firstpage
123
Lastpage
126
Abstract
In this report, a preliminary investigation has been conducted on some lead free solder pastes containing Sn88Ag3.5Bi0.5In8 alloy. The wetting performances of these solder pastes on different substrates were studied under various reflow profiles. The test results of solder ball, slump and printing properties indicate that with a proper paste flux vehicle, lead free solder paste using Sn88Ag3.5Bi0.5In8 alloy may achieve a good performance.
Keywords
adhesion; bismuth alloys; environmental factors; indium alloys; printed circuit manufacture; reflow soldering; shear strength; silver alloys; solders; tin alloys; viscosity; wetting; SnAgBiIn; electronic industry; lead free solder paste; printing properties; slump properties; solder ball; solderability; tackiness; various reflow profiles; viscosity; wetting performances; Copper alloys; Electronic components; Environmentally friendly manufacturing techniques; Humans; Lead; Performance evaluation; Printing; Temperature; Testing; Vehicles;
fLanguage
English
Publisher
ieee
Conference_Titel
Asian Green Electronics, 2004. AGEC. Proceedings of 2004 International IEEE Conference on the
Print_ISBN
0-7803-8203-X
Type
conf
DOI
10.1109/AGEC.2004.1290884
Filename
1290884
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