• DocumentCode
    2877542
  • Title

    Contact resistance and fretting corrosion of lead-free alloy coated electrical contacts

  • Author

    Wu, Ji ; Pecht, Michael G.

  • Author_Institution
    CALCE Electron. Products & Syst. Center, Maryland Univ., College Park, MD, USA
  • fYear
    2004
  • fDate
    2004
  • Firstpage
    127
  • Lastpage
    135
  • Abstract
    As lead-free solders replace tin-lead solders in soldering, it is also expected that lead-free solder alloys will be used as contact finish materials for electrical contacts. In this study, the contact resistance and fretting corrosion of tin-silver-copper and tin-copper coatings were investigated and compared with tin-lead eutectic coating. The contact resistance before after different aging conditions, including mixed flowing gas, steam, and dry heat aging, was examined. Tin-silver-copper and tin-lead alloy coatings have similar performance on contact resistance versus contact normal force after dry heat aging and MFG aging. Severe degradation was found on tin-silver-copper coatings after steam aging. Higher contact force is suggested in the application of tin-silver-copper solder alloy coating than for eutectic tin-lead alloy coatings. Fretting corrosion on tin-silver-copper and tin-copper lead-free alloy coatings was studied and compared with tin-lead coating. Fretting corrosion experiments were conducted and compared at different temperatures and normal forces. In general, tin-silver-copper and tin-copper alloys show equal or better fretting corrosion resistance than tin-lead eutectic alloy at the experimental conditions in this study.
  • Keywords
    ageing; contact resistance; copper alloys; corrosion; electrical contacts; silver alloys; solders; surface finishing; tin alloys; wear; SnAgCu; SnCu; aging conditions; contact finish materials; contact resistance; degradation; dry heat aging; electrical contacts; fretting corrosion; lead-free solders; mixed flowing gas aging; steam aging; Aging; Coatings; Contact resistance; Corrosion; Degradation; Environmentally friendly manufacturing techniques; Lead; Resistance heating; Soldering; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Asian Green Electronics, 2004. AGEC. Proceedings of 2004 International IEEE Conference on the
  • Print_ISBN
    0-7803-8203-X
  • Type

    conf

  • DOI
    10.1109/AGEC.2004.1290885
  • Filename
    1290885