DocumentCode
2877815
Title
Novel methodology for predictive interface reliability analysis in IC packages by a dual experimental and numerical approach
Author
Hertl, M. ; Weidmann, D. ; Chauffleur, X. ; Dubois, G.
Author_Institution
INSIDIX, Grenoble/Seyssins, France
fYear
2011
fDate
4-7 July 2011
Firstpage
1
Lastpage
5
Abstract
Works on predictive reliability of IC packages are mostly dedicated to the failure of solder joints as structural material. The failure of interfaces, as links between two different materials, is often neglected in the process. This paper presents a new methodology, combining experimental and numerical work, to close this gap.
Keywords
integrated circuit packaging; integrated circuit reliability; numerical analysis; solders; IC packages; interface reliability analysis; numerical analysis; solder joint failure; structural material; Delamination; Production; Stress; Surface topography; Temperature measurement; Time division multiplexing;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2011 18th IEEE International Symposium on the
Conference_Location
Incheon
ISSN
1946-1542
Print_ISBN
978-1-4577-0159-7
Electronic_ISBN
1946-1542
Type
conf
DOI
10.1109/IPFA.2011.5992773
Filename
5992773
Link To Document